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US 2023/0264258 A1Published application
Injection Molding Powder, Injection Molding Powder Production Method, And Metal Sintered Compact Production Method
AssigneeSeiko Epson Corporation
InventorYasutaka MATSUMOTO
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Abstract
An injection molding powder includes a metal powder, and a film with which a particle surface of the metal powder is coated and which contains a fluorine compound, in which a contact angle of hexadecane measured at 25° C. by a θ/2 method is 60° or more and 110° or less in a state in which the injection molding powder is laid in layers.
Claims12
An injection molding powder comprising:
- a metal powder;
- and
- a film with which a particle surface of the metal powder is coated and which contains a fluorine compound, wherein
- a contact angle of hexadecane measured at 25° C. by a θ/2 method is 60° or more and 110° or less in a state in which the injection molding powder is laid in layers.
1 more element
Dependencies are inferred from the claim text.