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US 2023/0264232 A1Published application
Substrate treating apparatus comprising ultrasonic wave cleaning unit
AssigneeDeviceeng Co., Ltd.
InventorTaek Youb LEE
Life of this patent
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Abstract
The present invention relates to a substrate treatment apparatus including: a chuck base rotatably disposed around a rotating shaft; chuck pins disposed on top of the chuck base to fix a substrate thereto; and an ultrasonic cleaning unit disposed on top of the chuck base to perform ultrasonic cleaning for the underside of the substrate.
Claims11
A substrate treatment apparatus comprising:
- a chuck base rotatably disposed around a rotating shaft;
- chuck pins disposed on top of the chuck base to fix a substrate thereto;
- and
- an ultrasonic cleaning unit disposed on top of the chuck base to perform ultrasonic cleaning for the underside of the substrate.
1 more element
Dependencies are inferred from the claim text.