Resonance device and resonance device manufacturing method
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshiyuki HIGUCHI, Masakazu FUKUMITSU
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Abstract
A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.
Claims17
A resonance device comprising:
- a first substrate that includes a resonator having a lower electrode and a wiring line layer electrically connected to the lower electrode;
- a second substrate;
- a bonding part that is electrically conductive and bonds the first substrate and the second substrate to each other;
- and
- an anti-diffusion layer electrically connecting the wiring line layer and the bonding part to each other.
A resonance device manufacturing method comprising:
- preparing a first substrate including a first metal layer, a resonator, a wiring line layer electrically connected to a lower electrode of the resonator, and an anti-diffusion layer electrically connecting the wiring line layer to the first metal layer;
- preparing a second substrate including a second metal layer;
- and
- bonding the first substrate and the second substrate to each other with a bonding part that includes a eutectic layer, the eutectic layer having a eutectic alloy of a first metal of the first metal layer and a second metal of the second metal layer as a main component.
Dependencies are inferred from the claim text.