Back to results
US 2023/0187338 A1Published application
Laminated body and laminated body manufacturing method
AssigneeCanon Anelva Corporation
InventorsHIROSHI YAKUSHIJI, REIJI SAKAMOTO, MASAHIRO SHIBAMOTO
Life of this patent
Estimating the term…
Abstract
Provided are a laminated body and a laminated body manufacturing method that can improve adhesiveness between a resin layer and a seed layer. The laminated body has a substrate, a first wiring layer, a resin layer, and a second wiring layer in this order, and the second wiring layer includes at least an adhesive layer and a seed layer in this order.
Claims14
A laminated body comprising:
- a first wiring layer;
- a resin layer;
- and a second wiring layer in this order,
- wherein the second wiring layer includes at least an adhesive layer and a seed layer in this order.
1 more element
A laminated body manufacturing method comprising:
- a first step of forming a titanium film on a resin layer;
- after the first step, a second step of forming a titanium carbide layer forming a part of an adhesive layer by applying energy to the titanium film;
- after the second step, a third step of forming a titanium layer forming a part of the adhesive layer on the titanium carbide layer;
- and
- after the third step, a fourth step of forming a seed layer on the titanium layer.
2 more elements
A laminated body comprising:
- a first wiring layer;
- a resin layer;
- and a second wiring layer in this order,
- wherein the second wiring layer includes an adhesive layer and a seed layer in this order,
- wherein the adhesive layer includes a titanium carbide layer and a titanium layer in this order, and
- wherein the titanium carbide layer is a layer formed by applying energy to a titanium film formed on the resin layer.
3 more elements
Dependencies are inferred from the claim text.