Heat dissipation structure and electronic device
AssigneeClevo Co.
InventorsWEI-CHENG LIAO, BO-XUAN CHEN, JUNG-CHUN CHEN
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Abstract
A heat dissipation structure and an electronic device are provided. The heat dissipation structure includes a first plate body, a second plate body, and m thermally conductive members. The m thermally conductive members are arranged between the first plate body and the second plate body. Among the m thermally conductive members, n thermally conductive members are arranged along at least one of a length direction of the first plate body and a length direction of the second plate body, or a width direction of the first plate body and a length direction of the second plate body, and m≥n≥2.
Claims10
A heat dissipation structure, comprising:
- a first plate body;
- a second plate body;
- and
- m thermally conductive members disposed between the first plate body and the second plate body;
- wherein n thermally conductive members of the m thermally conductive members are arranged along at least one of a length direction of the first plate body and a length direction of the second plate body, and a width direction of the first plate body and a length direction of the second plate body, and m≥n≥2.
An electronic device, comprising:
- at least one heat generating source;
- and
- at least one heat dissipation structure, the at least one heat dissipation structure including a first plate body, a second plate body, and m thermally conductive members, and one end of at least one of the m thermally conductive members is arranged adjacent to the at least one heat generating source;
- wherein the m thermally conductive members are disposed between the first plate body and the second plate body;
- wherein n thermally conductive members of the m thermally conductive members are arranged along at least one of a length direction of the first plate body and a length direction of the second plate body, and a width direction of the first plate body and a length direction of the second plate body, and m≥n≥2.
Dependencies are inferred from the claim text.