Microelectronic device cleaning composition
AssigneeEntegris, Inc.
InventorsAtanu K. Das, Daniela White, Michael L. White, Jun Liu, Aditya Dilip Verma
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Abstract
Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.
Claims19
A composition comprising:
- a. a chelating agent;
- b. a water-miscible solvent;
- c. a reducing agent;
- and
- d. a pH adjustor,
- wherein the composition has a pH of about 1.5 to about 13.
A method for removing residues from a microelectronic device substrate having said residues thereon, wherein the substrate possesses at least one surface comprising a substance chosen from copper, cobalt, tungsten, or a dielectric composition along with at least one surface comprising hydrophobic carbon or SiC,
- contacting the surface of a microelectronic device substrate with a composition comprising:
- a. a chelating agent;
- b. a water-miscible solvent;
- c. a reducing agent;
- and
- d. a pH adjustor,
- wherein the composition has a pH of about 2 to about 13;
- and at least partially removing said residues from said substrate.
Dependencies are inferred from the claim text.