Oled device structure and manufacturing method thereof
AssigneeWuhan China Star Optoelectron I Cs Semi Conductor Display Technology Co., Ltd.
InventorJiajia SUN
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Abstract
An organic light emitting diode (OLED) device structure and a manufacturing method thereof are provided. The OLED device structure includes a base layer, an array segment film layer, an organic light emitting layer, a thin film packing layer, a touch layer, a polarizer, a cover glass, a composite material layer, and a foam copper foil layer. The OLED device structure can solve problems of low penetration rate, poor heat dissipation, buffer layers are easy to peel, and easy breakage in backplane layers of current OLED panels.
Claims10
An organic light emitting diode (OLED) device structure, comprising:
- a base layer, an array segment film layer, an organic light emitting layer, and a thin film packing layer disposed sequentially from bottom to top;
- a touch layer, a polarizer, and a cover glass sequentially disposed above the thin film packing layer;
- a composite material layer disposed under the base layer;
- and
- a foam copper foil layer disposed under the composite material layer.
A manufacturing method of an organic light emitting diode (OLED) device structure, comprising following steps:
- providing a base layer;
- forming an array segment film layer, an organic light emitting layer, and a thin film packing layer on the base layer sequentially;
- forming a touch layer and a polarizer on the thin film packing layer sequentially;
- forming a composite material layer under the base layer;
- and
- forming a foam copper foil layer under the composite material layer and forming a cover glass on the polarizer.
Dependencies are inferred from the claim text.