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US 2023/0156915 A1Published application
Printed circuit board
AssigneeLG Innotek Co., Ltd.
InventorMyung Gu KANG
Life of this patent
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Abstract
Disclosed is a printed circuit board according to an embodiment. The printed circuit board comprises: a base board; a metal layer, including a pad and a metal line formed in the base board; a solder resist layer that is formed on the base board on which the metal layer is formed and has an opening through which the surface of the metal line is exposed; and an underfill that is formed between the solder resist layer and a semiconductor chip electrically connected to the pad and includes a blocking area formed in the opening.
Claims8
A printed circuit board comprising:
- a base board;
- a metal layer including a pad and a metal line formed on the base board;
- a solder resist layer formed on the base board on which the metal layer is formed and formed with an opening through which a surface of the metal line is exposed;
- and
- an underfill formed between the solder resist layer and a semiconductor chip electrically connected to the pad, and including a blocking area formed in the opening.
2 more elements
Dependencies are inferred from the claim text.