Dual resistor integration
OwnerBhaskar Srinivasan, Qi-Zhong Hong +1inventors
InventorsBhaskar Srinivasan, Qi-Zhong Hong, Jarvis Benjamin Jacobs
Life of this patent
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Abstract
An electronic device includes a first thin film resistor and a second thin film resistor above a dielectric layer that extends in a first plane of orthogonal first and second directions, the first resistor has three portions with the second portion extending between the first and third portions, and a recess etched into the top side of the second portion by a controlled etch process to increase the sheet resistance of the first resistor for dual thin film resistor integration.
Claims20
An electronic device, comprising:
- a semiconductor surface layer;
- a dielectric layer above the semiconductor surface layer, the dielectric layer having a side extending in a first plane of orthogonal first and second directions;
- a first resistor having opposite first and second sides and a recess, the first side of the first resistor above and facing the side of the dielectric layer, the second side of the first resistor extending in a second plane of the first and second directions, the first and second planes spaced apart from one another along a third direction that is orthogonal to the first and second directions, the recess extending into the second side of the first resistor along the third direction;
- a second resistor having opposite first and second sides, the second resistor spaced apart from the first resistor along one of the first and second directions, the first side of the second resistor above and facing the side of the dielectric layer, the second side of the second resistor extending in the second plane.
A resistor, comprising:
- a patterned film having opposite first and second sides, a first portion, a second portion, a third portion, and a recess;
- the first side extending in a plane of orthogonal first and second directions;
- the second portion extending between the first and third portions along the first direction;
- the recess extending into the second side of the second portion along a third direction that is orthogonal to the first and second directions.
A method of fabricating an electronic device, the method comprising:
- forming a film above a dielectric layer;
- patterning the film to define first and second resistors;
- and
- etching a portion of the first resistor to create a recess in a side of the first resistor.
Dependencies are inferred from the claim text.