Method and structure for 3dic power distribution
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Hao Tsai, Tzu-Chun Tang, Chuei-Tang Wang
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Abstract
Embodiments provide regulated power routing through various inactive features of a device. In one embodiment, such inactive features include a through via wall which can be formed in an encapsulating material of a die stack. In another embodiment, such inactive features include a heat dissipation features formed over the die stack. In another embodiment, such inactive features include dummy via blocks attached adjacent a die cube. Yet other embodiments may combine the features of these embodiments without limitation.
Claims20
A method comprising:
- mounting a second device die to a first device die to form a first package;
- mounting the first package to a substrate;
- coupling a power source line to the first package;
- and
- electrically coupling the power source line to a power plane of the first package, using a heat dissipation lid as the power plane or conductive features embedded in an encapsulant material adjacent the second die as the power plane.
A method comprising:
- bonding one or more second device dies to a first device die, the one or more second device dies arranged in a vertical stack;
- forming a vertical power plane adjacent the one or more second device dies;
- electrically coupling the first device die to the vertical power plane at one end of the vertical power plane;
- and
- electrically coupling a through via of the one or more second devices to the vertical power plane at an opposite end of the vertical power plane.
A semiconductor device, comprising:
- a substrate;
- at least one device die disposed on the substrate, wherein the at least one device die has a through-silicon via (TSV) structure therein;
- a voltage regulator disposed on the substrate and laterally separated from the at least one device die;
- and
- a metal structure disposed between the at least one device die and the voltage regulator, wherein the voltage regulator receives a power delivery passing through the TSV structure and the metal structure sequentially.
Dependencies are inferred from the claim text.