Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWei-Hao CHANG
Life of this patent
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Abstract
A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component.
Claims20
An electronic device, comprising:
- a first substrate,
- a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate,
- a first component disposed on the first surface of the second substrate;
- a second component disposed on the second surface of the second substrate;
- and
- a support member covering the first component;
- wherein the support member is configured to be attached to a tape so that a divided operation on the second substrate can be performed.
An electronic device, comprising:
- a first substrate,
- a second substrate disposed over the first substrate and having a first surface facing away from the first substrate, a second surface facing the first substrate and a side surface between the first surface and the second surface,
- a first component disposed on the first surface of the second substrate;
- a second component disposed on the second surface of the second substrate
- a third component disposed on the first substrate and under the second substrate;
- and
- a first package body covering the first component and having a lateral surface substantially coplanar with the side surface of the second substrate.
An electronic device, comprising:
- a first substrate having a first surface,
- a first component disposed on the first surface of the first substrate;
- a first package body disposed on the first surface of the first substrate and covering the first component;
- a second component adjacent to the first substrate and free from being covered by the first substrate;
- and
- a second package body covering the first package body and the second component.
Dependencies are inferred from the claim text.