Semiconductor package structure and method for forming the same

A method for forming a semiconductor package structure, comprising:

• providing an interposer substrate;
• providing a connecting element in the interposer substrate, wherein the connecting element comprises a dielectric element and conductive features disposed in the dielectric element;
• providing a first semiconductor device and a second semiconductor device on the interposer substrate, wherein the first semiconductor device and the second semiconductor device are electrically connected to the connecting element;
• and
• bonding the interposer substrate to a carrier substrate.

A method for forming a semiconductor package structure, comprising:

• providing an interposer substrate;
• providing a connecting element in the interposer substrate, wherein the connecting element comprises a dielectric element and conductive features disposed in the dielectric element;
• providing a first semiconductor device and a second semiconductor device on the interposer substrate, wherein the first semiconductor device and the second semiconductor device are electrically connected to the connecting element;
• forming a first underfill layer between the first semiconductor device, the second semiconductor device, and the interposer substrate;
• forming a package layer surrounding the first semiconductor device, the second semiconductor device, and the first underfill layer;
• bonding a carrier substrate to the interposer substrate;
• and
• forming a second underfill layer between the carrier substrate and the interposer substrate.