Semiconductor chip having stepped conductive pillars
AssigneesAdvanced Micro Devices, Inc., ATI Technologies ULC
InventorsSUMING HU, FARSHAD GHAHGHAHI
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Abstract
In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.
Claims20
A semiconductor chip comprising:
- a device layer;
- an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad;
- and
- a conductive pillar coupled to the conductive pad and including at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.
A semiconductor chip package comprising:
- a package substrate including a bond pad;
- and
- a semiconductor chip mounted on the package substrate, the semiconductor chip including:
- a device layer;
- an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad;
- and
- a conductive pillar interconnecting the conductive pad and the bond pad of the package substrate, the conductive pillar including at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, the second portion being disposed between the first portion and the package substrate, wherein the first width of the first portion is greater than the second width of the second portion.
A method of fabricating a semiconductor device having stepped conductive pillars, the method comprising:
- providing a semiconductor chip substrate including a conductive pad and a passivation layer through which the conductive pad is at least partially exposed;
- fabricating an under-bump metallization layer over an exposed portion of the conductive pad;
- fabricating a first portion of a conductive pillar over the conductive pad, wherein the first portion of the conductive pillar has a first width;
- and
- fabricating a second portion of the conductive pillar on the first portion, wherein the second portion has a second width that is smaller than the first width.
Dependencies are inferred from the claim text.