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US 2023/0154865 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Po-Yuan Su
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Abstract
An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.
Claims16
An electronic package, comprising:
- a carrier structure;
- an electronic module provided on the carrier structure and electrically connected thereto;
- a heat dissipation structure coupled with the electronic module;
- and
- adjustment structures coupled with the heat dissipation structure and located around the electronic module.
2 more elements
A manufacturing method of an electronic package, comprising
- providing an electronic module on a carrier structure, wherein the electronic module is electrically connected to the carrier module;
- coupling a heat dissipation structure with the electronic module;
- and
- coupling adjustment structures with the heat dissipation structure, wherein the adjustment structures are located around the electronic module.
1 more element
Dependencies are inferred from the claim text.