Semiconductor package assembly using a passive device as a standoff

A semiconductor package assembly comprising:

• a semiconductor package including a semiconductor chip bonded to a substrate;
• a plurality of passive devices mounted on a bottom surface of the substrate opposite the semiconductor chip, the plurality of passive devices including a plurality of operable passive devices and a plurality of standoff passive devices, wherein a height of each of the plurality of standoff passive devices is greater than a height of any of the plurality of operable passive devices;
• and
• a plurality of solder structures attached to the bottom surface of the substrate.

An apparatus comprising:

• a circuit board;
• a semiconductor package coupled to the circuit board by a plurality of solder structures, the semiconductor package including a semiconductor chip bonded to a substrate;
• and
• a plurality of passive devices mounted on a bottom surface of the substrate between the substrate and the circuit board, the plurality of passive devices including a plurality of operable passive devices and a plurality of standoff passive devices, wherein a height of each of the plurality of standoff passive devices is greater than a height of any of the plurality of operable passive devices.