Fluid cooling for die stacks
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsBelgacem Haba, Christopher Aubuchon
Life of this patent
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Abstract
The disclosed technology relates to microelectronic devices that can dissipate heat efficiently. In some aspects, such a microelectronic device includes a first semiconductor element and at least one second semiconductor element disposed on the first semiconductor element. The microelectronic device may further include a fluidic cooling unit disposed on the first semiconductor element. In some embodiment, the fluidic cooling unit may include a cavity structure to contain a fluid. In some embodiment, the fluidic cooling unit may include a thermal pathway to transfer heat away from the first semiconductor element.
Claims23
A microelectronic device comprising:
- a first semiconductor element;
- at least one second semiconductor element disposed on the first semiconductor element;
- and
- a fluidic cooling unit disposed on the first semiconductor element, the fluidic cooling unit comprising a cavity structure to contain a fluid, the fluidic cooling unit comprising a thermal pathway to transfer heat away from the first semiconductor element.
A method of forming a microelectronic device, the method comprising:
- providing a first semiconductor element;
- and
- bonding a second semiconductor element and a fluidic cooling unit to the first semiconductor element, such that the second semiconductor element and the fluidic cooling unit are disposed on the first semiconductor element,
- wherein the fluidic cooling unit comprises a cavity structure to contain a fluid, the fluidic cooling unit comprising a thermal pathway to transfer heat away from the first semiconductor element.
A microelectronic device comprising:
- a first semiconductor element;
- a fluidic cooling unit directly bonded to the first semiconductor element without an adhesive, the fluidic cooling unit comprising a cavity structure to contain a fluid.
Dependencies are inferred from the claim text.