Dual functional thermal performance semiconductor package and related methods of manufacturing

An electronic assembly, comprising:

• a circuit board;
• and
• a molded semiconductor package attached to the circuit board,
• wherein the molded semiconductor package comprises:
• a semiconductor die;
• a substrate attached to a first side of the semiconductor die;
• a plurality of leads electrically connected to a pad at a second side of the semiconductor die opposite the first side;
• a heat sink clip thermally coupled to the pad;
• and
• a molding compound encapsulating the semiconductor die, part of the leads, part of the heat sink clip, and at least part of the substrate,
• wherein the molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side,
• wherein the leads protrude from opposing first and second faces of the edge of the molding compound and attach to the circuit board,
• wherein the heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.