Ceramic Metal Circuit Board And Semiconductor Device Using The Same
AssigneesKabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
InventorsTakayuki NABA, Keiichi YANO, Hiromasa KATO
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Abstract
According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.
Claims16
A ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate, wherein at least one of the metal circuit plates has an area of not less than 100 mm2 and comprises a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates, and the concave portion is provided not less than 3 mm inside from an end of the at least one of the metal circuit plates, and
- wherein a sectional shape of the concave portion is at least one shape selected from a triangular shape or a shape with a convex portion formed at an inlet edge of the concave portion.
Dependencies are inferred from the claim text.