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US 2023/0154814 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorShotaro SAKUMOTO
Life of this patent
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Abstract
An object is to provide a technique for suppressing solder from peeling from a copper block. A copper block is bonded on a copper pattern via first solder and an electrode terminal is bonded on the copper block via second solder. The sealing resin covers the copper pattern, the first solder, the copper block, the second solder, the electrode terminal, and the semiconductor element. The area of the portion of the copper block bonded by the first solder is greater than the area of the portion of the copper block bonded by the second solder.
Claims5
A semiconductor device comprising:
- a copper pattern;
- a copper block bonded on the copper pattern via first solder;
- an electrode terminal bonded on the copper block via second solder;
- a semiconductor element electrically connected to the copper pattern;
- and
- a sealing resin covering the copper pattern, the first solder, the copper block, the second solder, the electrode terminal, and the semiconductor element, wherein
- an area of a portion of the copper block bonded by the first solder is greater than an area of a portion of the copper block bonded by the second solder.
4 more elements
Dependencies are inferred from the claim text.