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US 2023/0154810 A1Published application
Semiconductor packages with shortened talking path
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen, Ming-Fa Chen, Chih-Chia Hu
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Abstract
A semiconductor package includes a first die. The first die has a first side and a second side different from the first side and includes a first seal ring. The first seal ring includes a first portion at the first side and a second portion at the second side, and a width of the first portion is smaller than a width of the second portion.
Claims20
A semiconductor package, comprising:
- a first die having a first side and a second side different from the first side and comprising a first seal ring, wherein the first seal ring comprises a first portion at the first side and a second portion at the second side, and a width of the first portion is smaller than a width of the second portion.
A semiconductor package, comprising:
- a first die comprising a first seal ring;
- and
- a second die, wherein the first die and the second die are disposed along a horizontal direction and electrically connected to each other, a first side of the first die faces the second die, and the first seal ring is not disposed at the first side of the first die.
A semiconductor package, comprising:
- a first die comprising a first seal ring;
- a second die, the first die and the second die disposed along a horizontal direction;
- and
- a conductive bridge, wherein the conductive bridge extends between the first die and the second die along the horizontal direction, to electrically connect the first die and the second die, and the first seal ring is not overlapped with the conductive bridge from a top view.
1 more element
Dependencies are inferred from the claim text.