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US 2023/0148008 A1Published application
Light-emitting device with metal inlay and top contacts
AssigneeLumileds LLC
InventorsTze Yang HIN, Seng Huat LAU, Hideo KAGEYAMA
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Abstract
Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.
Claims1
A device comprising:
- a hybridized device having a top surface and a bottom surface;
- a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate, the metal inlay thermally coupled to the bottom surface of the hybridized device;
- a plurality of conductive contacts on the top surface of the packaging substrate;
- and
- a plurality of conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.
2 more elements
Dependencies are inferred from the claim text.