Semiconductor structure and method of fabricating the same

A method of fabricating a semiconductor structure, comprising:

• providing a substrate, wherein the substrate comprises a first surface and a second surface opposite to the first surface;
• forming a semiconductor device on the second surface of the substrate;
• forming at least one insulating vacancy and a through hole passing through the substrate in the substrate, wherein the insulating vacancy extends from the first surface to the second surface, and the at least one insulating vacancy passes through the substrate;
• and
• forming a conductive layer in the through hole, wherein the semiconductor device is electrically connected to the conductive layer, and the at least one insulating vacancy is distributed corresponding to the semiconductor device.