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US 2023/0147067 A1Published application
Cooling device having a boiling chamber with submerged condensation and method
AssigneeRochester Institute of Technology
InventorsSatish G. Kandlikar, Maharshi Shukla
Life of this patent
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Abstract
A device and method including a boiling chamber in which boiling occurs in a pool of liquid and condensation occurs in the same chamber to remove the heat from the condensation process of the bubbles generated during the boiling process mainly through submerged condensation are disclosed.
Claims20
A cooling device, comprising:
- a thermally conductive boiling chamber comprising a section configured to contain liquid, a section configured to contain vapor in contact with the section configured to contain liquid, and a heating section in communication with an external heat source and the section configured to contain liquid;
- and
- a cooling element configured to communicate with an external cooling source and disposed in at least the section configured to contain liquid, wherein when liquid is present in the section configured to contain liquid and heated in the heating section resulting in boiling and vapor generation in the form of bubbles within the liquid, heat is exchanged (a) between the liquid and the cooling element and (b) between the liquid and the bubbles, resulting in submerged condensation such that the heat transfer rate in the heating section is at least 50 Watts.
A boiling process for high heat dissipation, comprising:
- heating with an external heat source liquid within a partially filled thermally conductive sealed boiling chamber;
- and
- cooling with an external cooling source a cooling element at least partially submerged in the liquid within the boiling chamber, wherein heating the liquid causes boiling of the liquid and vapor generation resulting in the formation of vapor bubbles within the liquid and exchanging heat (a) between the liquid and the cooling element and (b) between the liquid and the vapor bubbles resulting in submerged condensation, such that the heat transfer rate to the boiling chamber is at least 50 Watts.
Dependencies are inferred from the claim text.