Wafer placement table
AssigneeNGK Insulators, Ltd.
InventorsSeiya INOUE, Tatsuya KUNO, Ikuhisa MORIOKA
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Abstract
A wafer placement table includes a ceramic base having a wafer placement surface on its top surface where a wafer is able to be placed and incorporating an electrode; a cooling base having a refrigerant flow channel; and a bonding layer that bonds the ceramic base with the cooling base, wherein in an area that overlaps the wafer placement surface in plan view of the refrigerant flow channel, a cross-sectional area of the refrigerant flow channel at a most downstream part of the refrigerant flow channel is less than the cross-sectional area at a most upstream part of the refrigerant flow channel.
Claims6
A wafer placement table comprising:
- a ceramic base having a wafer placement surface on its top surface where a wafer is able to be placed and incorporating an electrode;
- a cooling base having a refrigerant flow channel;
- and
- a bonding layer that bonds the ceramic base with the cooling base, wherein
- in an area that overlaps the wafer placement surface in plan view of the refrigerant flow channel, a cross-sectional area of the refrigerant flow channel at a most downstream part of the refrigerant flow channel is less than the cross-sectional area at a most upstream part of the refrigerant flow channel.
Dependencies are inferred from the claim text.