Semiconductor wafer and testing module

A semiconductor wafer, comprising:

• a scribe line extending along a first direction;
• and
• a probe pad disposed on the scribe line and configured to contact a probe needle, wherein the probe pad comprises:
• a first metal layer;
• a dielectric layer disposed on the first metal layer, wherein the dielectric layer comprises a first recess;
• and
• a second metal layer configured to connect to the first metal layer, wherein the second metal layer comprises a first portion and a second portion,
• wherein the first portion comprises a trench exposing the dielectric layer, and the second portion is disposed on the first recess and a top surface of the dielectric layer to form a first via.

A testing module, comprising

• a wafer, comprising:
• a scribe line extending along a direction;
• and
• a probe pad disposed on the scribe line, wherein the probe pad comprises:
• a first metal layer;
• a dielectric layer disposed on the first metal layer, wherein the dielectric layer comprises a first recess;
• and
• a second metal layer configured to connect to the first metal layer, wherein the second metal layer comprises a first portion and a second portion,
• wherein the first portion comprises a trench exposing the dielectric layer, and the second portion is disposed on the first recess and a top surface of the dielectric layer to form a first via;
• and
• a probe head, comprising multiple probe needles configured to correspond to a shape of the first portion of the probe pad.