Pressure-sensitive adhesive tape
AssigneeSekisui Chemical Co., Ltd.
InventorsShouji KAJI, Takaaki SAKON, Taku SASAKI
Life of this patent
Estimating the term…
Loading patent…
AssigneeSekisui Chemical Co., Ltd.
InventorsShouji KAJI, Takaaki SAKON, Taku SASAKI
Estimating the term…
The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising a photo-cured acrylic resin, a metal having a lower potential than that of iron, and an electroconductive material, wherein the pressure-sensitive adhesive layer has a total light transmittance X, per micrometer of the thickness, of 99.85% or less, and the pressure-sensitive adhesive layer has a total light transmittance Y of 6% or more. The present invention can provide a pressure-sensitive adhesive tape having a great adhesive force on both the front side and the back side and having good sacrificial corrosion resistance.
A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising a photo-cured acrylic resin, a metal having a lower potential than that of iron, and an electroconductive material other than the metal, the pressure-sensitive adhesive layer having a total light transmittance X, per micrometer of a thickness thereof, of 99.85% or less, and the pressure-sensitive adhesive layer having a total light transmittance Y of 6% or more.
A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising a metal having a lower potential than that of iron, and carbon nanotube.
Dependencies are inferred from the claim text.