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US 2023/0145304 A1Published application
Electronic device and method for manufacturing the same
AssigneeInnolux Corporation
InventorsYi-Hung LIN, Chun-Hung LAI, Chun-Chin FAN
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Abstract
An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.
Claims20
An electronic device, comprising:
- a first insulating layer;
- a first metal bump disposed on the first insulating layer;
- and
- a second insulating layer disposed on the first metal bump, wherein the second insulating layer comprises a first opening exposing a portion of the first metal bump,
- wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.
2 more elements
A method for manufacturing an electronic device, comprising the following steps:
- providing a substrate;
- forming a first insulating layer on the substrate;
- forming a first metal bump on the first insulating layer;
- and
- forming a second insulating layer on the first metal bump, wherein the second insulating layer comprises a first opening exposing a portion of the first metal bump,
- wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.
3 more elements
Dependencies are inferred from the claim text.