Substrate structure, on-chip structure, and method for manufacturing on-chip structure

Abstract

The application relates to a substrate structure, an on-chip structure, and a method for manufacturing the on-chip structure. The substrate structure includes a substrate body and an electrothermal layer. The electrothermal layer is arranged on a surface of the substrate body for growing an epitaxial layer. In an actual lift off process of the epitaxial layer, only the electrothermal layer is electrically conducted to an external power supply via an electrode, and heating of the electrothermal layer is utilized to heat the epitaxial layer, therefore, a part of the epitaxial layer in contact with the substrate structure can be thermally decomposed and separated from the substrate structure.

Dependencies are inferred from the claim text.