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US 2023/0145080 A1Published application
Polishing liquid and polishing method
AssigneeShowa Denko Materials Co., Ltd.
InventorsDaisuke IIKURA, Masako AOKI
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Abstract
A polishing liquid containing: abrasive grains containing a hydroxide of a tetravalent metal element; a monovalent acid component having no carboxy group; and a non-ionic polymer, in which a pH is 4.5 or less. A polishing method including a step of polishing a surface to be polished by using this polishing liquid.
Claims19
A polishing liquid comprising:
- abrasive grains containing a hydroxide of a tetravalent metal element;
- a monovalent acid component having no carboxy group;
- and a non-ionic polymer, wherein
- a pH is 4.5 or less.
1 more element
Dependencies are inferred from the claim text.