Electronic package, optoelectronic package and method of manufacturing the same

An electronic package, comprising:

• a first electronic component;
• a carrier comprising a conductive layer and defining a cavity accommodating the first electronic component, wherein the carrier and the first electronic component collectively define a gap;
• an electrical bonding element electrically connected to the conductive layer;
• and
• a barrier configured to block a passage by which the electrical bonding element contacts a surface of the first electronic component or enters the gap.

An optoelectronic package, comprising:

• a carrier;
• a light-emitting element disposed adjacent to the carrier;
• a substrate electrically connecting the light-emitting element to the carrier via a bonding element;
• and
• a barrier disposed between the bonding element and the light-emitting element.