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US 2023/0143672 A1Published application
Molded microfluidic substrate having microfluidic channel
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Michael G. Groh
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Abstract
A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.
Claims15
A molded microfluidic substrate comprising:
- a molding compound layer;
- and
- a microfluidic channel formed within the molding compound layer and corresponding to a sacrificial metal bond wire.
A method comprising:
- providing a metal bond layer;
- attaching a sacrificial metal bond wire to the metal bond layer;
- bending the sacrificial metal bond wire in correspondence with a microfluidic channel to be formed;
- applying a molding compound, encasing the sacrificial metal bond wire within a molding compound layer;
- removing a portion of the molding compound layer, exposing the sacrificial metal bond wire within the molding compound layer;
- and
- etching away the sacrificial metal bond wire, yielding a molded microfluidic substrate having the microfluidic channel formed within the molding compound layer and corresponding to the etched-away sacrificial metal bond wire.
4 more elements
An electronic device comprising:
- a molded microfluidic substrate having a microfluidic channel corresponding to a sacrificial metal bond wire or ribbon, and a metal component corresponding to a non-sacrificial metal bond wire or ribbon;
- and
- an integrated circuit in conductive contact with the metal component, in fluidic contact with the microfluidic channel, or in conductive contact with the metal component and in fluidic contact with the microfluidic channel.
Dependencies are inferred from the claim text.