Focus ring, substrate processing apparatus including the same, and substrate processing method using the same

A substrate processing apparatus, comprising:

• an electrostatic chuck;
• a focus ring on the electrostatic chuck;
• and
• an outer ring that surrounds the focus ring,
• wherein the focus ring includes:
• a first ring;
• and
• a second ring,
• wherein the first ring includes:
• a first ring body;
• and
• a protrusion member that extends outwardly from the first ring body,
• wherein a top-most surface of the protrusion member is at a vertical level lower than a vertical level of a top-most surface of the first ring body,
• wherein a portion of the second ring is on the protrusion member,
• wherein another portion of the second ring is on the outer ring, and
• wherein a bottom surface of the second ring is vertically spaced apart from and not in contact with the top-most surface of the protrusion member to form a gap between the second ring and the protrusion member.

A substrate processing apparatus, comprising:

• an electrostatic chuck;
• a focus ring on the electrostatic chuck;
• and
• a ring lift pin that extends in a first direction,
• wherein the focus ring includes:
• a first ring formed around an axis that is parallel to the first direction;
• and
• a second ring not affixed to the first ring, and of which at least a portion is positioned outwardly from the first ring, with respect to the axis,
• wherein the ring lift pin is disposed below the second ring.