Thermal testing system having safety feature(s) and multiple independently controlled thermoelectric coolers

A thermal testing system comprising:

• a plurality of thermoelectric coolers, each thermoelectric cooler having first and second opposing surfaces, each thermoelectric cooler configured to have a temperature differential between the first and second opposing surfaces of the respective thermoelectric cooler, which is caused by a Peltier effect, based on a respective input voltage, each subset of a plurality of subsets of the thermoelectric coolers positioned between a respective first heat exchanger of one or more first heat exchangers and a respective second heat exchanger of one or more second heat exchangers, each subset including at least one of the plurality of thermoelectric coolers;
• a thermal controller comprising a plurality of variable voltage sources that are configured to control the plurality of respective thermoelectric coolers independently, each variable voltage source configured to generate a respective input voltage that corresponds to a respective target temperature differential such that the respective input voltage causes a respective thermoelectric cooler of the plurality of thermoelectric coolers to have the respective target temperature differential between the first and second opposing surfaces of the respective thermoelectric cooler;
• the one or more first heat exchangers, each first heat exchanger configured to transfer heat between a respective subset of the thermoelectric coolers and a fluid;
• the one or more second heat exchangers, each second heat exchanger configured to transfer heat between a respective semiconductor device of one or more semiconductor devices and a respective subset of the thermoelectric coolers;
• and
• a processing system configured to identify a target temperature of a designated semiconductor device of the one or more semiconductor devices by reviewing a temperature indicator that indicates the target temperature, which is manually set by a user of the thermal testing system or which is programmatically set by software;
• wherein the processing system is further configured to determine whether a human or programmatic error occurs with regard to setting of the target temperature based at least in part on whether an absolute value of the target temperature is greater than or equal to a first temperature threshold;
• and
• wherein the processing system is further configured to cause each variable voltage source of the plurality of variable voltage sources to not provide the respective input voltage to the respective thermoelectric cooler based at least in part on a determination that the human or programmatic error occurs with regard to the setting of the target temperature as a result of the absolute value of the target temperature being greater than or equal to the first temperature threshold.

A thermal testing system comprising:

• a plurality of thermoelectric coolers, each thermoelectric cooler having first and second opposing surfaces, each thermoelectric cooler configured to have a temperature differential between the first and second opposing surfaces of the respective thermoelectric cooler, which is caused by a Peltier effect, based on a respective input voltage, each subset of a plurality of subsets of the thermoelectric coolers positioned between a respective first heat exchanger of one or more first heat exchangers and a respective second heat exchanger of one or more second heat exchangers, each subset including at least one of the plurality of thermoelectric coolers;
• a thermal controller comprising a plurality of variable voltage sources that are configured to control the plurality of respective thermoelectric coolers independently, each variable voltage source configured to generate a respective input voltage that corresponds to a respective target temperature differential such that the respective input voltage causes a respective thermoelectric cooler of the plurality of thermoelectric coolers to have the respective target temperature differential between the first and second opposing surfaces of the respective thermoelectric cooler;
• the one or more first heat exchangers, each first heat exchanger configured to transfer heat between a respective subset of the thermoelectric coolers and a fluid;
• the one or more second heat exchangers, each second heat exchanger configured to transfer heat between a respective semiconductor device of one or more semiconductor devices and a respective subset of the thermoelectric coolers;
• and
• a current sensor configured to detect a plurality of currents that are provided to the plurality of respective thermoelectric coolers;
• wherein each variable voltage source is configured to discontinue providing the respective input voltage to the respective thermoelectric cooler based at least in part on a magnitude of the current that is provided to the respective thermoelectric cooler, as detected by the current sensor, being less than or equal to a current threshold.