Polishing composition and polishing method
AssigneeFujimi Incorporated
InventorKohsuke TSUCHIYA
Life of this patent
Estimating the term…
Abstract
Provided is a polishing composition that can achieve wettability enhancement and haze reduction of a polished surface of a silicon wafer. The polishing composition for a silicon wafer contains an abrasive, a cellulose derivative, a surfactant, a basic compound, and water. Here, the cellulose derivative has a weight average molecular weight of more than 120×104, and the surfactant has a molecular weight of less than 4000.
Claims10
A polishing composition for silicon wafer, the polishing composition comprising an abrasive, a cellulose derivative, a surfactant, a basic compound, and water, wherein
- the cellulose derivative has a weight average molecular weight of more than 120×104, and
- the surfactant has a molecular weight of less than 4000.
A method for polishing a silicon wafer, the method comprising a stock polishing step and a final polishing step, wherein the final polishing step includes polishing a substrate to be polished using a polishing composition,
- wherein the polishing composition comprises an abrasive, a cellulose derivative, a surfactant, a basic compound, and water, the cellulose derivative has a weight average molecular weight of more than 120×104, and the surfactant has a molecular weight of less than 4000.
Dependencies are inferred from the claim text.