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US 2023/0141772 A1Published application
SMA Resin Formulation
AssigneeIsola USA Corp.
InventorsEdward Kelley, Teck Kai Wong, Rebekah F. Theisen, Christopher G. Clark, JR.
Life of this patent
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Abstract
Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
Claims20
A resin composition comprising:
- styrene maleic anhydride co-polymer;
- at least one epoxy resin;
- at least one cross-linking agent;
- talc;
- and
- silica.
3 more elements
A resin composition comprising:
- from about 5 to about 40 wt % on a dry solvent free resin basis of a styrene maleic anhydride co-polymer;
- from about 10 to about 50 wt % on a dry solvent free resin basis of at least one epoxy resin is selected from a brominated bisphenol A, a brominated bisphenol F, a non-brominated bisphenol A, a non-brominated bisphenol F and combinations thereof;
- from about greater than 0 to about 20 wt % on a dry solvent free resin basis of at least one cross-linking agent is selected from tetrabromobisphenol A, tetra-DOPO-bisphenol A and mixtures thereof;
- from about 2.5 to about 15 wt % on a dry resin basis of talc;
- and
- from about 2.5 to about 15 wt % on a dry resin basis of fumed silica.
3 more elements
20-25. (canceled)
Dependencies are inferred from the claim text.