A semiconductor apparatus comprising:
- an element substrate including an effective pixel region having a plurality of effective pixels on one principal surface of a first substrate, and a peripheral region positioned around the effective pixel region;
- a second substrate;
- and
- a first bonding member and a second bonding member configured to bond the element substrate and the second substrate,
- wherein the second bonding member contains a material different from a material of the first bonding member,
- wherein the first bonding member is disposed between the peripheral region and the second substrate,
- wherein the second bonding member is provided between the effective pixel region and the second substrate, and
- wherein, in a planar view with respect to the one principal surface, the element substrate has a polygonal shape, and
- wherein, in a planar view with respect to the one principal surface, the first bonding member includes two portions separated at a corner portion of the second substrate.