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US 2023/0141270 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
Life of this patent
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Abstract
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
Claims23
A printed circuit board comprising:
- a first insulating material;
- and
- a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other,
- wherein at least one groove portion is disposed in a side surface of each of the first and second cavities.
1 more element
A printed circuit board comprising:
- a first insulating material;
- a second insulating material disposed on one surface of the first insulating material, and including a plurality of cavities having depths different from each other;
- and
- a resin layer at least partially embedded in the second insulating material, and disposed on a bottom surface of at least one of the plurality of cavities.
1 more element
A printed circuit board comprising:
- a first insulating material;
- a plurality of insulating layers disposed on the first insulating material, and including first and second cavities penetrating through one or more of the plurality of insulating layers;
- and
- a plurality of circuit layers disposed on or embedded in the plurality of insulating layers, respectively,
- wherein a first number of insulating layers among the plurality of insulating layers, penetrated through by the first cavity, is different from a second number of insulating layers among the plurality of insulating layers, penetrated through by the second cavity.
2 more elements
Dependencies are inferred from the claim text.