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US 2023/0123649 A1Published application
Photosensitive resin composition, molded article that is provided with pattern, and method for producing molded article that is provided with pattern
AssigneeSumitomo Seika Chemicals Co., Ltd.
InventorShinya MURAKAMI
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Abstract
Disclosed is a photosensitive resin composition containing a polymerizable component and used to form a resin layer in an imprint method including forming a reverse pattern of a pattern of a mold on a resin layer by using the mold having the pattern. The polymerizable component contains an organic sulfur compound. A viscosity of the photosensitive resin composition at 25° C. is less than 20 mPa·s.
Claims12
A photosensitive resin composition comprising:
- a polymerizable component,
- wherein the photosensitive resin composition is used to form a resin layer in an imprint method including forming a reverse pattern of a pattern of a mold on a resin layer by using the mold having the pattern,
- wherein the polymerizable component contains an organic sulfur compound, and
- a viscosity of the photosensitive resin composition at 25° C. is less than 20 mPa·s.
1 more element
Dependencies are inferred from the claim text.