Electronic device housing and electronic device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyunjung JUNG, Hangyu HWANG, Hyeonseok YOON, Hyoin KIM
Life of this patent
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Abstract
An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.
Claims20
An electronic device housing, comprising:
- an instrument;
- a first primer layer provided to cover the instrument;
- a film layer provided on the first primer layer;
- a second primer layer provided on the film layer;
- and
- a coating layer provided on the second primer layer,
- wherein the film layer has at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.
A method of manufacturing an electronic device housing, comprising:
- preparing an instrument;
- forming a first primer layer by applying a first primer on the instrument;
- forming a film layer on the first primer layer;
- forming a second primer layer by applying a second primer on the film layer;
- and
- forming a coating layer on the second primer layer,
- wherein the forming of the film layer comprises:
- surrounding the first primer layer with a film comprising metal particles, and applying heat thereto.
An electronic device surrounded by an electronic device housing, wherein the electronic device housing comprising:
- an instrument;
- a first primer layer provided to surround the instrument;
- a film layer provided on the first primer layer;
- a second primer layer provided on the film layer;
- and
- a coating layer provided on the second primer layer,
- wherein the film layer has at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.
Dependencies are inferred from the claim text.