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US 2023/0101791 A1Published application
Thermosetting resin composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKouichi AOKI, Tomoyuki AOKI
Life of this patent
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Abstract
A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).
Claims20
A thermosetting resin composition containing
- an ethylene-propylene-diene copolymer (A),
- a terminal-modified polyphenylene ether compound (B),
- an inorganic filler (C),
- a styrene-based elastomer (D), and
- a fibrous filler (E).
2 more elements
Dependencies are inferred from the claim text.