Electronic apparatus and cooling module
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsMasahiro Kitamura, Yusuke Onoue, Takuroh Kamimura, Akinori Uchino
Life of this patent
Estimating the term…
Loading patent…
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsMasahiro Kitamura, Yusuke Onoue, Takuroh Kamimura, Akinori Uchino
Estimating the term…
An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.
An electronic apparatus comprising:
A cooling module configured to absorb heat from a plurality of heating elements in a chassis of an electronic apparatus, comprising:
Dependencies are inferred from the claim text.