Substrate processing method and substrate processing apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorsKei SUZUKI, Masaki INABA
Life of this patent
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Abstract
The substrate processing method includes a liquid film forming step of forming a liquid film of a sulfuric acid-containing liquid on a principal surface of a substrate, an ozone-containing gas exposing step of filling an ozone-containing gas inside a processing chamber capable of housing the substrate to expose the liquid film to the ozone-containing gas, and a substrate heating step of heating the substrate in a state that the substrate is disposed inside the processing chamber which is filled with the ozone-containing gas and the liquid film is also formed on the principal surface of the substrate.
Claims16
A substrate processing method comprising:
- a liquid film forming step of forming a liquid film of a sulfuric acid-containing liquid on a principal surface of a substrate;
- an ozone-containing gas exposing step of filling an ozone-containing gas inside a processing chamber capable of housing the substrate to expose the liquid film to the ozone-containing gas, and
- a substrate heating step of heating the substrate in a state that the substrate is disposed inside the processing chamber which is filled with the ozone-containing gas and the liquid film is also formed on the principal surface of the substrate.
A substrate processing apparatus comprising:
- a substrate holder to hold a substrate in a predetermined processing posture;
- a processing chamber capable of housing the substrate held by the substrate holder:
- a substrate heating member to heat the substrate held by the substrate holder:
- an ozone-containing gas supplying member to supply an ozone-containing gas into the processing chamber;
- a sulfuric acid-containing liquid ejecting member to eject a sulfuric acid-containing liquid toward a principal surface of the substrate held by the substrate holder:
- and
- a controller programmed to control the substrate heating member, the ozone-containing gas supplying member, and the sulfuric acid-containing liquid ejecting member, wherein
- the controller is programmed so that in a state that the substrate held by the substrate holder is disposed inside the processing chamber and the substrate is also heated by the substrate heating member, the sulfuric acid-containing liquid is ejected from the sulfuric acid-containing liquid ejecting member toward the principal surface of the substrate, thereby forming a liquid film of the sulfuric acid-containing liquid on the principal surface of the substrate, and the ozone-containing gas is also supplied from the ozone-containing gas supplying member to the processing chamber.
Dependencies are inferred from the claim text.