Semiconductor device, and manufacturing method for same
AssigneeUltramemory Inc.
InventorMasatoshi HASEGAWA
Life of this patent
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Abstract
A semiconductor device has laminated therein three or more chips. The plurality of chips are provided with substrates, transmission coils, and reception coils that are disposed in regions where the transmission coils and the reception coils do not overlap with each other in an in-plane direction of the substrates. The transmission coils are disposed in regions that are in a lamination direction and that are adjacent to and overlap with reception coils of other chips. The reception coils are configured to allow data transmission with respect to the transmission coils that are disposed on the same substrates.
Claims12
A semiconductor device comprising:
- three or more chips stacked on each other,
- wherein each of the chips includes
- a substrate,
- a transmission coil, and
- a reception coil provided in a region where the reception coil does not overlap with the transmission coil in an in-plane direction of the substrate,
- the transmission coil is arranged in a region where the transmission coil is adjacent to and overlaps with the reception coil of another chip in a stacking direction, and
- the reception coil is configured such that data is transmittable between the reception coil and the transmission coil arranged on the same substrate.
Dependencies are inferred from the claim text.