Packaged surface acoustic wave device with conductive pillar

A packaged surface acoustic wave device comprising:

• a multilayer piezoelectric substrate having a via formed therein, the multilayer piezoelectric substrate including a support substrate and a piezoelectric layer over the support substrate;
• an interdigital transducer electrode over the piezoelectric layer;
• a roof structure over the interdigital transducer electrode;
• and
• a conductive support structure disposed between the multilayer piezoelectric substrate and the roof structure, the conductive support structure supporting the roof structure and defining at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via.

A packaged surface acoustic wave device comprising:

• a support substrate having a conductive via formed therein;
• a piezoelectric layer over the support substrate;
• an interdigital transducer electrode over the piezoelectric layer;
• a nonconductive roof structure over the interdigital transducer electrode;
• and
• a conductive pillar disposed between the support substrate and the nonconductive roof structure, the conductive pillar supporting the nonconductive roof structure, the conductive pillar is nonelectrically coupled with the roof structure.