Deposition apparatus, deposition target structure, and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hsi WANG, Yen-Yu CHEN
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Abstract
A deposition apparatus includes a process chamber, a wafer support in the process chamber, a backplane structure having a first surface in the process chamber facing the wafer support, a target having a second surface facing the first surface and a third surface facing the wafer support, and an adhesion structure in physical contact with the backplane structure and the target. The adhesion structure has an adhesion material layer, and a spacer embedded in the adhesion material layer.
Claims21
1-16. (canceled)
A method, comprising:
- positioning a jig on a backplane structure of a physical vapor deposition target;
- positioning a spacer comprising a first material on the backplane structure by guidance of the jig,wherein inner width and length of the jig are substantially equal to width and length of the spacer, respectively;
- forming an adhesion structure by embedding the spacer in an adhesion material layer comprising a second material different from the first material;
- and
- attaching a target to the backplane structure by the adhesion structure.
The method of claim 1, wherein the spacer is the same material as the backplane structure, and a different material than the adhesion material layer.
A method, comprising:
- positioning a jig on a backplane structure of a physical vapor deposition target;
- positioning a spacer on the backplane structure by guidance of the jig, wherein inner width and length of the jig are substantially equal to width and length of the spacer, respectively;
- forming an adhesion structure by embedding the spacer and the jig in an adhesion material layer;
- removing the jig from the adhesion material layer;
- and
- attaching a target to the backplane structure by the adhesion structure with the jig removed.
A method, comprising:
- positioning a jig on a backplane structure of a physical vapor deposition target, the backplane structure having a first machine lock pattern;
- positioning a spacer on the backplane structure by guidance of the jig;
- forming an adhesion structure by embedding the spacer and the jig in an adhesion material layer;
- removing the jig from the adhesion material layer;
- and
- attaching a target to the backplane structure by the adhesion structure with the jig removed, the target having a second machine lock pattern corresponding to the first machine lock pattern.
Dependencies are inferred from the claim text.