Conductive organic module for semiconductor devices and associated systems and methods

A semiconductor device, comprising:

• a package substrate having a mounting surface, wherein the mounting surface includes a die attach region and an electrical region adjacent the die attach region;
• a stack of semiconductor dies carried by the die attach region of the package substrate, the stack of semiconductor dies including a first sub-stack carried by the package substrate and a second sub-stack carried by the first sub-stack;
• and
• an organic conductive module carried by the package substrate and electrically coupled to a first bond pad in the electrical connection region, the organic conductive module having a first end electrically coupled to the first bond pad and a second end opposite the first end, and wherein at least one die in the second sub-stack is electrically coupled to a second bond pad on the second end of the organic conductive module.

A method for manufacturing a semiconductor package, the method comprising:

• stacking one or more first semiconductor dies on a stacking region of a package substrate;
• forming a first wire bond connection between the one or more first semiconductor dies and a first bond pad on the package substrate adjacent the stacking region;
• attaching a vertical interconnect module to the package substrate, the vertical interconnect module including:
• a first end electrically coupled directly to a second bond pad on the package substrate adjacent the stacking region,
• a second end opposite the first end,
• a conductive via extending through a body of organic material from the first end to the second end, and
• a third bond pad at the second end;
• stacking one or more second semiconductor dies on an uppermost first semiconductor die;
• and
• forming a second wire bond connection between the one or more second semiconductor dies and the third bond pad on the vertical interconnect module.