US 2023/0069183 A1 · STACKED STRUCTURE WITH INTERPOSER

Abstract

Stacked structures having interposers adhered to packaging substrates are disclosed. In one example, a stacked structure can include a laminate substrate. The stacked structure can also include an interposer mounted on the laminate substrate without solder, for example by an electrically nonconductive adhesive layer. A plurality of conductive vias can be extending through the interposer, and through the nonconductive adhesive layer if present, and connecting to the laminate substrate. The stacked structure can also include a redistribution layer (RDL) adjacent to the interposer. The RDL can be configured to electrically connect to an electronic device. Methods for forming such stacked structures are also disclosed.

Claims18

Dependent claims

A stacked structure, comprising:

a laminate substrate;
an interposer mounted on the laminate substrate by an adhesive layer, a plurality of conductive vias extending through the interposer and the nonconductive adhesive layer and connecting to the laminate substrate;
and
a redistribution layer (RDL) adjacent to the interposer.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

17/823,430Filed 30 Aug 2022

Priority

1 Sep 2021

Published

2 Mar 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification15 codes

H10W 40/613
Bolts or screws: for stacked arrangements of a plurality of semiconductor devices
H10W 70/611
Insulating or insulated package substrates; Interposers; Redistribution layers: for connecting multiple chips together
H10W 20/40
Interconnections in chips, wafers or substrates: interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or…
H10W 70/095
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: of vias therein

Stacked structure with interposer

Life of this patent

Stacked structure with interposer

Life of this patent

Abstract

Claims18