3d-printed ceramics with conductor infusion for ultra-high-speed electronics
AssigneeSchlumberger Technology Corporation
InventorsJohn Michael Beshears, Steven O. Dunford
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Abstract
The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.
Claims27
A method of making an electrically conductive apparatus, the method comprising:
- 3D-printing a ceramic material into a ceramic substrate, the ceramic substrate including a void;
- infusing a material into the void;
- and
- retrieving the ceramic substrate with the material within the void, wherein the material is electrically conductive.
A method of making an electrically conductive apparatus, the method comprising:
- 3D-printing a first ceramic material into a first portion of a ceramic substrate, the first portion of the ceramic substrate including a first void;
- infusing a first material into the first void;
- forming a second portion of the ceramic substrate by 3D-printing a second ceramic material onto the first portion of the ceramic substrate, the second portion of the ceramic substrate including a second void;
- infusing a second material into the second void;
- and
- retrieving the ceramic substrate with the first and second material within the first and second voids, wherein the first and second materials are electrically conductive materials.
A circuit board, the circuit board comprising:
- a ceramic substrate, the ceramic substrate including a plurality of voids;
- and
- an electrically conductive material within the plurality of voids, wherein the electrically conductive material defines an electrically conductive wiring assembly of the circuit board, the electrically conductive wiring assembly comprising a via, and wherein the circuit board lacks capture pads.
Dependencies are inferred from the claim text.