Integrated circuits and methods for power delivery
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing Chian TSAI, Shih-Wei PENG, Wei-Cheng LIN, Jiann-Tyng TZENG
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Abstract
An integrated circuit includes a first power rail, a second power rail, and a power tap cell. The first power rail is at a first side of the integrated circuit. The second power rail is at a second side of the integrated circuit. The first and second sides are on opposite sides of at least a complementary field effect transistor. The power tap cell is coupled to the first power rail and the second power rail and configured to provide power from the first power rail to the second power rail.
Claims20
An integrated circuit, comprising:
- a first power rail at a first side of the integrated circuit;
- a second power rail at a second side of the integrated circuit, the first and second sides being on opposite sides of at least a complementary field effect transistor;
- and
- a power tap cell coupled to the first power rail and the second power rail and configured to provide power from the first power rail to the second power rail.
An integrated circuit, comprising:
- a first power rail at a first side of the integrated circuit;
- a second power rail at a second side of the integrated circuit, the first and second sides being on opposite sides of at least a complementary field effect transistor;
- and
- a via wall coupled between the first power rail and the second power rail and configured to provide power from the first power rail to the second power rail.
A method of fabricating an integrated circuit, the method comprising:
- forming a first set of conductive structures in a first layer of the integrated circuit, the first set of conductive structures extending in a first direction and being separate from each other in a second direction different from the first direction;
- forming a second set of conductive structures in a second layer of the integrated circuit different from the first layer, the second set of conductive structures extending in the second direction and being separate from each other in the first direction;
- forming a set of active regions in a third layer of the integrated circuit different from the first and second layers;
- forming a set of gates in the third layer;
- forming a third set of conductive structures in a fourth layer of the integrated circuit, the third set of conductive structures extending in the first direction and being separate from each other in the second direction,
- wherein the fourth layer and the second layer are on opposite sides of the integrated circuit;
- and
- forming a set of vias between the second set of conductive structures and the third set of conductive structures, the set of vias coupling the second set of conductive structures to the third set of conductive structures.
Dependencies are inferred from the claim text.