Tamper-respondent sensors with random three-dimensional security patterns

A method comprising:

• producing a plurality of tamper-respondent sensors for a plurality of tamper-respondent assemblies, the producing comprising for each tamper-respondent sensor:
• establishing a security circuit pattern for a security circuit of the tamper-respondent sensor to enclose, at least in part, one or more components of a respective circuit board within a secure volume, the establishing comprising:
• obtaining in three dimensions boundaries for the security circuit of the tamper-respondent sensor, the boundaries defining a sensor volume within which the security circuit is to reside;
• generating at least one trace configuration for the security circuit pattern, the at least one trace configuration defining a random, three-dimensional security pattern within the sensor volume, and the at least one trace configuration establishing, at least in part, the security circuit pattern;
• confirming that the security circuit pattern is distinct from any other security circuit pattern of the plurality of tamper-respondent sensors;
• and
• fabricating the tamper-respondent sensor using, at least in part, the established security circuit pattern.

A tamper-respondent assembly comprising:

• a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume, the tamper-respondent sensor having a security circuit within a sensor volume, the security circuit comprising:
• at least one conductive trace in the sensor volume of the tamper-respondent sensor, the at least one conductive trace having a random, three-dimensional security pattern within the sensor volume, and the at least one conductive trace including one or more trace segments extending at a diagonal in three dimensions within the sensor volume;
• and
• a monitor circuit to monitor the security circuit of the tamper-respondent sensor for a tamper event.